Structural & Thermal

Structural & Thermal

  1. All Categories
  2. Structures - Structural & Thermal
  3. What is a common cause of non-convergence in thermal analysis of electronic systems?

What is a common cause of non-convergence in thermal analysis of electronic systems?

Tagged: , , , , ,

    • June 5, 2023 at 7:04 am
      FAQFAQ
      Participant

      Incorrect contact pairs is generally the case with most thermal analyses in electronic systems due to very thin members in the assembly.

Featured Articles

Introducing Ansys Electronics Desktop on Ansys Cloud

The Watch & Learn video article provides an overview of cloud computing from Electronics Desktop and details the product licenses and subscriptions to ANSYS Cloud Service that are...

How to Create a Reflector for a Center High-Mounted Stop Lamp (CHMSL)

This video article demonstrates how to create a reflector for a center high-mounted stop lamp. Optical Part design in Ansys SPEOS enables the design and validation of multiple...

Introducing the GEKO Turbulence Model in Ansys Fluent

The GEKO (GEneralized K-Omega) turbulence model offers a flexible, robust, general-purpose approach to RANS turbulence modeling. Introducing 2 videos: Part 1 provides background information on the model and a...

Postprocessing on Ansys EnSight

This video demonstrates exporting data from Fluent in EnSight Case Gold format, and it reviews the basic postprocessing capabilities of EnSight.

© 2023 Copyright ANSYS, Inc. All rights reserved.