Tagged: ansys-icepak, cells, DDRs, ECAD, fans, grilles, heat sinks, layers, metal fractions, metallization, PCBs, thermal, vias
July 4, 2022 at 7:00 amWatch & LearnParticipant
This video shows how metal fractions are used in ANSYS Icepak to calculate thermal conductivity distribution in an ECAD design. The video also covers some best practices regarding their usage. To describe the usage of the metal fractions a complex polygonal printed circuit board is used. Watch the video to learn more about working with layer metallization in Icepak.
Introducing Ansys Electronics Desktop on Ansys Cloud
The Watch & Learn video article provides an overview of cloud computing from Electronics Desktop and details the product licenses and subscriptions to ANSYS Cloud Service that are...
How to Create a Reflector for a Center High-Mounted Stop Lamp (CHMSL)
This video article demonstrates how to create a reflector for a center high-mounted stop lamp. Optical Part design in Ansys SPEOS enables the design and validation of multiple...
Introducing the GEKO Turbulence Model in Ansys Fluent
The GEKO (GEneralized K-Omega) turbulence model offers a flexible, robust, general-purpose approach to RANS turbulence modeling. Introducing 2 videos: Part 1 provides background information on the model and a...
Postprocessing on Ansys EnSight
This video demonstrates exporting data from Fluent in EnSight Case Gold format, and it reviews the basic postprocessing capabilities of EnSight.
- Electrothermal Design of Power Converters for Electric Propulsion Systems – III
- Electrothermal Design of Power Converters for Electric Propulsion Systems – II
- Creating Icepak-Compatible Objects in SpaceClaim
- Creating an Icepak-Compatible Fan in SpaceClaim
- ANSYS Icepak: Computing Metal Fraction and Thermal Conductivity of a Trace
- Creating Icepak-Compatible Grilles and Openings
- Importing BRD file in Classic Icepak
- ANSYS Icepak: Importing Geometry Using Libraries
- ANSYS Icepak: Creating Object Groups
- ANSYS Icepak: Using Metal Fractions to Calculate an ECAD’s Thermal Conductivity
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